IC MODULE, IC CARD, AND IC MODULE SUBSTRATE

Provided are an IC module, an IC card, and an IC module substrate that can reduce the manufacturing cost without degrading the external appearance of a contact terminal. An IC module includes a contact terminal (10) provided on a front surface (1a) of a base member (1) and having a contact surface,...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: HOSAKA, Kazuhiro, YODOKAWA, Seiji, ONO, Shuji, MORIYA, Takehiko
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
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