IC MODULE, IC CARD, AND IC MODULE SUBSTRATE

Provided are an IC module, an IC card, and an IC module substrate that can reduce the manufacturing cost without degrading the external appearance of a contact terminal. An IC module includes a contact terminal (10) provided on a front surface (1a) of a base member (1) and having a contact surface, for contact with an external terminal, formed of a gold plating layer (14) ; an IC chip (55) attached to a back surface (1b) of the base member (1) ; a conductive member (a wire (60), a first conductive layer (20), and a second conductive layer (30)) connecting the IC chip (55) and the contact terminal (10) to each other through a through hole (3) opened at the front surface (1a) and the back surface (1b) of the base member (1); and an insulating surface material (40) partially covering the front surface (1a). At least a part of a region, overlapping the IC chip (55) in plan view, of the front surface (1a) is set as a non-forming region where a noble metal plating layer is not formed, and the surface material (40) is disposed in the non-forming region.