PRINTING SCREENS, METHODS OF FABRICATING THE SAME AND METHODS OF SCREEN PRINTING

A stencil 2 comprises a plurality of first print apertures 15 and a plurality of second print apertures 17 which intersect the first print apertures 15. The second print apertures 17 include a web 21 defining a plurality of sub-apertures 23. The first print apertures may be for printing metallizatio...

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Bibliographische Detailangaben
Hauptverfasser:	CUNNUSAMY, JESSEN, FOOT, GEORGE HAROLD BERTRAM, LAYCOCK, PAUL DAVID, FALCON, TOM, MURRAY, RICHARD JOHN, BAILEY, LEE EDWARD JAMES, ZAHN, MICHAEL
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS COLOUR PRINTING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LINING MACHINES MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MATERIALS FOR SURFACES USED IN PRINTING MACHINES FOR PRINTING,INKING, DAMPING, OR THE LIKE PERFORMING OPERATIONS PREPARING SUCH SURFACES FOR USE AND CONSERVING THEM PRINTED CIRCUITS PRINTING PRINTING PLATES OR FOILS PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES PROCESSES FOR THE MANUFACTURE OR REPRODUCTION OF PRINTINGSURFACES STAMPS TRANSPORTING TYPEWRITERS
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Beschreibung
Zusammenfassung:	A stencil 2 comprises a plurality of first print apertures 15 and a plurality of second print apertures 17 which intersect the first print apertures 15. The second print apertures 17 include a web 21 defining a plurality of sub-apertures 23. The first print apertures may be for printing metallization lines on wafers and the second print apertures may be for printing busbars on wafers. The stencil 2 may be used for forming silicon solar cells. The stencil 2 may be formed having two layers (7, 9, Fig.3). There may be applied a first tension (F1, Fig.1) to the first print apertures 15 and a second lower tension (F2, Fig.1) applied to the second print apertures 17. There is also provided a method of fabricating a stencil including providing a first patterning layer to a mandrel of an electro-forming apparatus and subsequently providing a second patterning layer to the first patterning layer. The first and second patterning layers may be a dry film resist.