Sensor package

A sensor package comprises a carrier (11) comprising a through hole (111), and a sensor chip (2) with a front side (fs) and a back side (bs) and a recess (21) in the back side (bs). The sensor chip (2) is attached to the carrier (11) with its back side (bs) facing the carrier (11) by means of an att...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	HUNZIKER, WERNER, PUSTAN, DAVID
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES MEASURING MICROSTRUCTURAL TECHNOLOGY PERFORMING OPERATIONS PHYSICS PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS SEMICONDUCTOR DEVICES TESTING TRANSPORTING
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Beschreibung
Zusammenfassung:	A sensor package comprises a carrier (11) comprising a through hole (111), and a sensor chip (2) with a front side (fs) and a back side (bs) and a recess (21) in the back side (bs). The sensor chip (2) is attached to the carrier (11) with its back side (bs) facing the carrier (11) by means of an attachment layer (4) thereby defining a first area (A1) of the carrier (2) the sensor chip (2) rests on and a second area (A2) of the carrier (11) facing the recess (21). The through hole (111) is arranged in the first area (A1) of the carrier (11).