ADDITIVE FOR A SILICONE ENCAPSULANT

An additive for a silicone encapsulant has the structure: Formula (I) wherein R1 and R2 are each -O-Si(R4)(R5)(R6) and each of R4, R5, and R6 is independently chosen from C1-C10 hydrocarbyl groups, C1-C10 alkyl groups, C2-C10 alkenyl groups, and C6-C10 aryl groups, and wherein R3 is independently ch...

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Hauptverfasser: KLEYER, Donald L, XU, Shengqing, SCHMIDT, Randall G, TOMASIK, Adam C
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creator KLEYER, Donald L
XU, Shengqing
SCHMIDT, Randall G
TOMASIK, Adam C
description An additive for a silicone encapsulant has the structure: Formula (I) wherein R1 and R2 are each -O-Si(R4)(R5)(R6) and each of R4, R5, and R6 is independently chosen from C1-C10 hydrocarbyl groups, C1-C10 alkyl groups, C2-C10 alkenyl groups, and C6-C10 aryl groups, and wherein R3 is independently chosen from C1-C10 hydrocarbyl groups, C1-C10 alkyl groups, C2-C10 alkenyl groups, and C6-C10 aryl groups. The additive is formed using a method that includes the step of reacting iron metal or an iron (III) compound with a hydroxyl functional organosiloxane. An encapsulant includes the additive and a polyorganosiloxane. The encapsulant can be utilized to form a device that includes an electronic component and the encapsulant disposed on the electronic component. The device is formed using a method that includes the step of disposing the encapsulant on the electronic device.
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The additive is formed using a method that includes the step of reacting iron metal or an iron (III) compound with a hydroxyl functional organosiloxane. An encapsulant includes the additive and a polyorganosiloxane. The encapsulant can be utilized to form a device that includes an electronic component and the encapsulant disposed on the electronic component. 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subjects CHEMISTRY
COMPOSITIONS BASED THEREON
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
THEIR PREPARATION OR CHEMICAL WORKING-UP
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
title ADDITIVE FOR A SILICONE ENCAPSULANT
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