Method for attaching a thermal pad to a heat sink, corresponding heat sink and electronic card
The present disclosure relates to a method for attaching at least a changing state pad to a heat sink configured to be mounted with at least an electronic chip. According to a particular embodiment, said method comprises: - heating said heat sink to at least a given temperature, bringing said heat s...
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| Format: | Patent |
| Sprache: | eng ; fre ; ger |
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| Zusammenfassung: | The present disclosure relates to a method for attaching at least a changing state pad to a heat sink configured to be mounted with at least an electronic chip.
According to a particular embodiment, said method comprises:
- heating said heat sink to at least a given temperature, bringing said heat sink to a heated state;
- positioning, while said heat sink is in said heated state, at least a first part of said changing state pad in contact with at least a surface of said heated heat sink, said surface being intended to face said chip once mounted. |
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