LED MODULE

A method of forming a component module is disclosed. A base is provided, the base being electrically conductive. An insulative layer is also provided on the base, with a first area being substantially free of the insulative layer. First and second traces are provided on the insulative layer adjacent...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	PICINI, MICHAEL C, MCGOWAN, DANIEL B
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS BLASTING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY HEATING LIGHTING MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MECHANICAL ENGINEERING NON-PORTABLE LIGHTING DEVICES PRINTED CIRCUITS SEMICONDUCTOR DEVICES SYSTEMS THEREOF VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLEEXTERIORS WEAPONS
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Beschreibung
Zusammenfassung:	A method of forming a component module is disclosed. A base is provided, the base being electrically conductive. An insulative layer is also provided on the base, with a first area being substantially free of the insulative layer. First and second traces are provided on the insulative layer adjacent the first area, with these traces extending therefrom. A die is positioned on the first area and electrically connected to the first and second traces. Finally, a protective layer is provided over the die.