MULTILAYER MOLDING

According to the present invention, it is possible to provide a resin-made multilayer molding including two or more resin layers, the multilayer molding being characterized in that: at least one resin layer of the multilayer molding is configured from a mixed resin (B) containing, at a ratio (C)/(D)...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: IWASAKI Atsuko, SUNADA Tomoe, SATO Kazunobu, MIYABE Takanori, ARAI Hirokatsu
Format: Patent
Sprache:eng ; fre ; ger
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Beschreibung
Zusammenfassung:According to the present invention, it is possible to provide a resin-made multilayer molding including two or more resin layers, the multilayer molding being characterized in that: at least one resin layer of the multilayer molding is configured from a mixed resin (B) containing, at a ratio (C)/(D) = 99/1 to 10/90 by weight, a polyamide resin (C) obtained by polymerizing a diamine component containing 70 mol% or more of m-xylylenediamine and a dicarboxylic acid component containing 70 mol% or more of adipic acid, and a polyester resin (D) containing a dicarboxylic acid unit and a diol unit, 1-80 mol% of the diol unit having a cyclic acetal skeleton; and at least one resin layer in contact with a layer configured from the mixed resin (B) is configured from a resin containing 70 wt% or more of a thermoplastic polyester resin (A) obtained by polymerizing a dicarboxylic acid component containing 80 mol% or more of terephthalic acid and a diol component containing 80 mol% or more of ethylene glycol.