ULTRASONIC PROBE AND METHOD OF MANUFACTURING THE SAME

ULTRASONIC PROBE AND METHOD OF MANUFACTURING THE SAME

An ultrasonic probe includes a connection layer including a conductor array for connecting a transducer array and a printed circuit board (PCB) to an application specific integrated circuit (ASIC). The ultrasonic probe includes a transducer array which transmits and receives an ultrasonic wave, a fi...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: Lee, Jong Mok, Cho, Young Mun, Gu, Jin Ho, Kim, Jae-Yk
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
ELECTRICITY
FOR PERFORMING MECHANICAL WORK IN GENERAL
GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICALVIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY
PERFORMING OPERATIONS
TRANSPORTING
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:An ultrasonic probe includes a connection layer including a conductor array for connecting a transducer array and a printed circuit board (PCB) to an application specific integrated circuit (ASIC). The ultrasonic probe includes a transducer array which transmits and receives an ultrasonic wave, a first electronic circuit electrically connected to the transducer array, a second electronic circuit electrically connected to the first electronic circuit, and a connection layer disposed between the transducer array and the first electronic circuit and including a first conductor array in contact with the transducer array so that the transducer array is electrically connected to the first electronic circuit and a second conductor array in contact with the second electronic circuit so that the second electronic circuit is electrically connected to the first electronic circuit.