THERMALLY CONDUCTIVE DIELECTRIC FOR THERMOFORMABLE CIRCUITS

This invention is directed to a polymer thick film thermally conductive thermoformable dielectric composition comprising urethane resin, thermoplastic phenoxy resin, diacetone alcohol and thermally conductive powder. Dielectrics made from the composition can be used in various electronic application...

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Bibliographische Detailangaben
Hauptverfasser:	ARANCIO, Vincenzo, DORFMAN, Jay Robert
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRONIC CIRCUITRY CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRICITY METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PULSE TECHNIQUE THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	This invention is directed to a polymer thick film thermally conductive thermoformable dielectric composition comprising urethane resin, thermoplastic phenoxy resin, diacetone alcohol and thermally conductive powder. Dielectrics made from the composition can be used in various electronic applications to protect electrical elements and particularly to insulate and protect both the conductive thermoformable silver and the polycarbonate substrate in capacitive switch applications. The thermoformed electrical circuit may be subsequently subjected to an injection molding process.