LIGHT EMITTING DEVICE PACKAGE

An embodiment relates to a light-emitting device package. In an embodiment, the light-emitting device package includes a package body configured to include a top surface, a plate guide unit disposed on the top surface, and a cavity formed in the top surface, a light-emitting device disposed within t...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	Tanda, Yuichiro, Ozeki, Satoshi
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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Beschreibung
Zusammenfassung:	An embodiment relates to a light-emitting device package. In an embodiment, the light-emitting device package includes a package body configured to include a top surface, a plate guide unit disposed on the top surface, and a cavity formed in the top surface, a light-emitting device disposed within the cavity, a plate disposed on the top surface of the package body and guided by the plate guide unit, and an adhesive member disposed between the top surface of the package body and the plate. The adhesive member includes a base layer made of a flexible material, a first adhesive tape disposed between the base layer and the top surface of the package body and bonded to the base layer and the top surface of the package body, and a second adhesive tape disposed between the base layer and the plate and bonded to the base layer and the plate.