CONNECTION ARRANGEMENT WITH A MULTILAYER RIBBON BOND WIRE

Bibliographische Detailangaben

Hauptverfasser:	Reinold, Manfred, Minkenberg, Bernd, Mueller, Immanuel, Erbe, Bjoern
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM PERFORMING OPERATIONS SEMICONDUCTOR DEVICES TRANSPORTING
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