CURABLE RESIN COMPOSITION

Provided is a curable resin composition that can provide a cured product having good transparency and being capable of suppressing occurrence of spots. This curable resin composition contains a silicon-containing compound (A) having a silanol group and an aryl group, a silicon-containing compound (B...

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Bibliographische Detailangaben
Hauptverfasser:	TAKEI YOSHIHITO, SAIKI TAKEAKI, KIM EMI
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	Provided is a curable resin composition that can provide a cured product having good transparency and being capable of suppressing occurrence of spots. This curable resin composition contains a silicon-containing compound (A) having a silanol group and an aryl group, a silicon-containing compound (B) having at least two silicon atom-bonded hydrogen atoms and at least one aryl group in one molecule, a branched-chain organopolysiloxane (C) having an alkenyl group and an aryl group, and a hydrosilylation reaction catalyst (D).