MODULAR ELECTRONICS CHASSIS

An apparatus for removing a modular electronic device from a chassis and a method for assembling thereof are provided. The apparatus for removing the modular electronic device from the chassis includes a door pivotally coupled to the chassis, a sliding element in slidable engagement with the door, a...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: CARVER, JON, HUNT, TAD, DRUKER, JOSHUA, PRIVITERA, PETER, BALAN, RAMESH, BROCKETT, DOUGLAS
Format: Patent
Sprache:eng ; fre ; ger
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Beschreibung
Zusammenfassung:An apparatus for removing a modular electronic device from a chassis and a method for assembling thereof are provided. The apparatus for removing the modular electronic device from the chassis includes a door pivotally coupled to the chassis, a sliding element in slidable engagement with the door, an ejection actuator including a spring member connected to the ejection actuator and to the rear of the chassis, and a linkage element connecting the sliding element with the ejection actuator. Additionally, the apparatus for removing the modular electronic device from the chassis includes a guide rail disposed in the chassis enclosure to guide the modular electronic device and to guide the ejection actuator along the chassis enclosure.