INK COMPOSITION

There is provided an ink composition, including: a combination of specific dyes, in which the dynamic contact angle of the ink to a silicon wafer is 24° or lower at 100 msec after dropping, and is 9° or lower at 5,100 msec after dropping.

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Bibliographische Detailangaben
Hauptverfasser:	TERAMOTO, RYOSUKE, OHORI, HIROMI, MIYAKE, YUHO
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	ADHESIVES CHEMICAL PAINT OR INK REMOVERS CHEMISTRY COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS CORRECTING FLUIDS DYES FILLING PASTES INKS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS PAINTS PASTES OR SOLIDS FOR COLOURING OR PRINTING POLISHES USE OF MATERIALS THEREFOR WOODSTAINS
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Beschreibung
Zusammenfassung:	There is provided an ink composition, including: a combination of specific dyes, in which the dynamic contact angle of the ink to a silicon wafer is 24° or lower at 100 msec after dropping, and is 9° or lower at 5,100 msec after dropping.