MONOLITHIC INTEGRATED CIRCUIT DIE HAVING MODULAR DIE REGIONS STITCHED TOGETHER

MONOLITHIC INTEGRATED CIRCUIT DIE HAVING MODULAR DIE REGIONS STITCHED TOGETHER

An apparatus for a monolithic integrated circuit die is disclosed. In this apparatus, the monolithic integrated circuit die has a plurality of modular die regions. The modular die regions respectively have a plurality of power distribution networks for independently powering each of the modular die...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser: CAMAROTA, Rafael, C
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
BASIC ELECTRONIC CIRCUITRY
ELECTRICITY
MEASURING
MEASURING ELECTRIC VARIABLES
MEASURING MAGNETIC VARIABLES
PHYSICS
PULSE TECHNIQUE
TESTING
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Beschreibung
Zusammenfassung:An apparatus for a monolithic integrated circuit die is disclosed. In this apparatus, the monolithic integrated circuit die has a plurality of modular die regions. The modular die regions respectively have a plurality of power distribution networks for independently powering each of the modular die regions. Each adjacent pair of the modular die regions is stitched together with a respective plurality of metal lines.