POLAR ADHESIVE RESINS FOR LOW-ENERGY SURFACES

POLAR ADHESIVE RESINS FOR LOW-ENERGY SURFACES

For adhesive bonding to low-energy substrates, the use of an adhesive resin having a softening point of up to 115°C as an adhesive resin for polyacrylate pressure-sensitive adhesives is specified, the adhesive resin having a molar mass distribution that is characterised in that the integral of the c...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: LI, Yuan, SPIES, Manfred, IHRIG, Ralf
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE
ADHESIVES
CHEMISTRY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
DYES
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL
ORGANIC MACROMOLECULAR COMPOUNDS
PAINTS
POLISHES
THEIR PREPARATION OR CHEMICAL WORKING-UP
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
USE OF MATERIALS AS ADHESIVES
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:For adhesive bonding to low-energy substrates, the use of an adhesive resin having a softening point of up to 115°C as an adhesive resin for polyacrylate pressure-sensitive adhesives is specified, the adhesive resin having a molar mass distribution that is characterised in that the integral of the curve of the molar mass distribution up to a molar mass of 350 g/mol makes up at least 15% of the total area under the curve of the molar mass distribution. The integral of the curve of the molar mass distribution up to a molar mass of 350 g/mol preferably makes up at most 20% of the total area under the curve of the molar mass distribution.