CORELESS PACKAGE STRUCTURE

CORELESS PACKAGE STRUCTURE

A structure comprising: a die embedded in a coreless substrate, a dielectric material adjacent the die, die pad interconnect structures disposed in a die pad area of the die, and at least one functionalized carrier structure disposed within the coreless substrate, wherein a top surface of the at lea...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: NALLA, Ravi, K, GUZEK, John, S, DELANEY, Drew, W, AZIMI, Hamid, R, GONZALEZ, Javier Soto
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:A structure comprising: a die embedded in a coreless substrate, a dielectric material adjacent the die, die pad interconnect structures disposed in a die pad area of the die, and at least one functionalized carrier structure disposed within the coreless substrate, wherein a top surface of the at least one functionalized carrier structure is coplanar with a top surface of the coreless substrate.