COPPER-FINE-PARTICLE DISPERSION LIQUID, CONDUCTIVE-FILM FORMATION METHOD, AND CIRCUIT BOARD
[Technical Problem] Provided is a copper particulate dispersion that can facilitate the formation of a conductive film with low electric resistance by photo-sintering. [Solution to Problem] A copper particulate dispersion 1 comprises a dispersion vehicle and copper particulates 11 dispersed in the d...
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| creator | KAWATO, YUICHI KUDO, TOMIO ARIMURA, HIDETOSHI |
| description | [Technical Problem] Provided is a copper particulate dispersion that can facilitate the formation of a conductive film with low electric resistance by photo-sintering. [Solution to Problem] A copper particulate dispersion 1 comprises a dispersion vehicle and copper particulates 11 dispersed in the dispersion vehicle. The copper particulate dispersion 1 contains a sintering promoter. The sintering promoter is a compound that removes copper oxide from copper at a temperature higher than ambient temperature. The sintering promoter thereby removes surface oxide coatings from the copper particulates 11 during the photo-sintering of the copper particulates 11. |
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[Solution to Problem] A copper particulate dispersion 1 comprises a dispersion vehicle and copper particulates 11 dispersed in the dispersion vehicle. The copper particulate dispersion 1 contains a sintering promoter. The sintering promoter is a compound that removes copper oxide from copper at a temperature higher than ambient temperature. The sintering promoter thereby removes surface oxide coatings from the copper particulates 11 during the photo-sintering of the copper particulates 11.</description><language>eng ; fre ; ger</language><subject>ADHESIVES ; BASIC ELECTRIC ELEMENTS ; CABLES ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CASTING ; CHEMICAL PAINT OR INK REMOVERS ; CHEMISTRY ; COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS ; CONDUCTORS ; CORRECTING FLUIDS ; DYES ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; FILLING PASTES ; INKS ; INSULATORS ; MAKING METALLIC POWDER ; MANUFACTURE OF ARTICLES FROM METALLIC POWDER ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; PAINTS ; PASTES OR SOLIDS FOR COLOURING OR PRINTING ; PERFORMING OPERATIONS ; POLISHES ; POWDER METALLURGY ; PRINTED CIRCUITS ; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES ; TRANSPORTING ; USE OF MATERIALS THEREFOR ; WOODSTAINS ; WORKING METALLIC POWDER</subject><creationdate>2016</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20160323&DB=EPODOC&CC=EP&NR=2998967A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20160323&DB=EPODOC&CC=EP&NR=2998967A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KAWATO, YUICHI</creatorcontrib><creatorcontrib>KUDO, TOMIO</creatorcontrib><creatorcontrib>ARIMURA, HIDETOSHI</creatorcontrib><title>COPPER-FINE-PARTICLE DISPERSION LIQUID, CONDUCTIVE-FILM FORMATION METHOD, AND CIRCUIT BOARD</title><description>[Technical Problem] Provided is a copper particulate dispersion that can facilitate the formation of a conductive film with low electric resistance by photo-sintering. [Solution to Problem] A copper particulate dispersion 1 comprises a dispersion vehicle and copper particulates 11 dispersed in the dispersion vehicle. The copper particulate dispersion 1 contains a sintering promoter. The sintering promoter is a compound that removes copper oxide from copper at a temperature higher than ambient temperature. The sintering promoter thereby removes surface oxide coatings from the copper particulates 11 during the photo-sintering of the copper particulates 11.</description><subject>ADHESIVES</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CABLES</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CASTING</subject><subject>CHEMICAL PAINT OR INK REMOVERS</subject><subject>CHEMISTRY</subject><subject>COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS</subject><subject>CONDUCTORS</subject><subject>CORRECTING FLUIDS</subject><subject>DYES</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>FILLING PASTES</subject><subject>INKS</subject><subject>INSULATORS</subject><subject>MAKING METALLIC POWDER</subject><subject>MANUFACTURE OF ARTICLES FROM METALLIC POWDER</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>METALLURGY</subject><subject>MISCELLANEOUS APPLICATIONS OF MATERIALS</subject><subject>MISCELLANEOUS COMPOSITIONS</subject><subject>NATURAL RESINS</subject><subject>PAINTS</subject><subject>PASTES OR SOLIDS FOR COLOURING OR PRINTING</subject><subject>PERFORMING OPERATIONS</subject><subject>POLISHES</subject><subject>POWDER METALLURGY</subject><subject>PRINTED CIRCUITS</subject><subject>SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES</subject><subject>TRANSPORTING</subject><subject>USE OF MATERIALS THEREFOR</subject><subject>WOODSTAINS</subject><subject>WORKING METALLIC POWDER</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2016</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNyrEKwjAQgOEuDqK-wz2AHVRQM8bLlR4kuZimLg6lSJxEC_X9sYIP4PTDzzcvrighUCwr9lQGHROjJTDcTLNh8WD53LJZA4o3LSa-0GStg0qi0-krHKVaJqG9AeSILSc4iY5mWczu_WPMq18XBVSUsC7z8OryOPS3_MzvjsJWqaPaH_Rm9wf5AC_KMc4</recordid><startdate>20160323</startdate><enddate>20160323</enddate><creator>KAWATO, YUICHI</creator><creator>KUDO, TOMIO</creator><creator>ARIMURA, HIDETOSHI</creator><scope>EVB</scope></search><sort><creationdate>20160323</creationdate><title>COPPER-FINE-PARTICLE DISPERSION LIQUID, CONDUCTIVE-FILM FORMATION METHOD, AND CIRCUIT BOARD</title><author>KAWATO, YUICHI ; KUDO, TOMIO ; ARIMURA, HIDETOSHI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP2998967A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; ger</language><creationdate>2016</creationdate><topic>ADHESIVES</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CABLES</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CASTING</topic><topic>CHEMICAL PAINT OR INK REMOVERS</topic><topic>CHEMISTRY</topic><topic>COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS</topic><topic>CONDUCTORS</topic><topic>CORRECTING FLUIDS</topic><topic>DYES</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>FILLING PASTES</topic><topic>INKS</topic><topic>INSULATORS</topic><topic>MAKING METALLIC POWDER</topic><topic>MANUFACTURE OF ARTICLES FROM METALLIC POWDER</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>METALLURGY</topic><topic>MISCELLANEOUS APPLICATIONS OF MATERIALS</topic><topic>MISCELLANEOUS COMPOSITIONS</topic><topic>NATURAL RESINS</topic><topic>PAINTS</topic><topic>PASTES OR SOLIDS FOR COLOURING OR PRINTING</topic><topic>PERFORMING OPERATIONS</topic><topic>POLISHES</topic><topic>POWDER METALLURGY</topic><topic>PRINTED CIRCUITS</topic><topic>SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES</topic><topic>TRANSPORTING</topic><topic>USE OF MATERIALS THEREFOR</topic><topic>WOODSTAINS</topic><topic>WORKING METALLIC POWDER</topic><toplevel>online_resources</toplevel><creatorcontrib>KAWATO, YUICHI</creatorcontrib><creatorcontrib>KUDO, TOMIO</creatorcontrib><creatorcontrib>ARIMURA, HIDETOSHI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KAWATO, YUICHI</au><au>KUDO, TOMIO</au><au>ARIMURA, HIDETOSHI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>COPPER-FINE-PARTICLE DISPERSION LIQUID, CONDUCTIVE-FILM FORMATION METHOD, AND CIRCUIT BOARD</title><date>2016-03-23</date><risdate>2016</risdate><abstract>[Technical Problem] Provided is a copper particulate dispersion that can facilitate the formation of a conductive film with low electric resistance by photo-sintering. [Solution to Problem] A copper particulate dispersion 1 comprises a dispersion vehicle and copper particulates 11 dispersed in the dispersion vehicle. The copper particulate dispersion 1 contains a sintering promoter. The sintering promoter is a compound that removes copper oxide from copper at a temperature higher than ambient temperature. The sintering promoter thereby removes surface oxide coatings from the copper particulates 11 during the photo-sintering of the copper particulates 11.</abstract><oa>free_for_read</oa></addata></record> |
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| language | eng ; fre ; ger |
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| source | esp@cenet |
| subjects | ADHESIVES BASIC ELECTRIC ELEMENTS CABLES CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CASTING CHEMICAL PAINT OR INK REMOVERS CHEMISTRY COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS CONDUCTORS CORRECTING FLUIDS DYES ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY FILLING PASTES INKS INSULATORS MAKING METALLIC POWDER MANUFACTURE OF ARTICLES FROM METALLIC POWDER MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS PAINTS PASTES OR SOLIDS FOR COLOURING OR PRINTING PERFORMING OPERATIONS POLISHES POWDER METALLURGY PRINTED CIRCUITS SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES TRANSPORTING USE OF MATERIALS THEREFOR WOODSTAINS WORKING METALLIC POWDER |
| title | COPPER-FINE-PARTICLE DISPERSION LIQUID, CONDUCTIVE-FILM FORMATION METHOD, AND CIRCUIT BOARD |
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