COPPER-FINE-PARTICLE DISPERSION LIQUID, CONDUCTIVE-FILM FORMATION METHOD, AND CIRCUIT BOARD

[Technical Problem] Provided is a copper particulate dispersion that can facilitate the formation of a conductive film with low electric resistance by photo-sintering. [Solution to Problem] A copper particulate dispersion 1 comprises a dispersion vehicle and copper particulates 11 dispersed in the d...

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Bibliographische Detailangaben
Hauptverfasser: KAWATO, YUICHI, KUDO, TOMIO, ARIMURA, HIDETOSHI
Format: Patent
Sprache:eng ; fre ; ger
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Zusammenfassung:[Technical Problem] Provided is a copper particulate dispersion that can facilitate the formation of a conductive film with low electric resistance by photo-sintering. [Solution to Problem] A copper particulate dispersion 1 comprises a dispersion vehicle and copper particulates 11 dispersed in the dispersion vehicle. The copper particulate dispersion 1 contains a sintering promoter. The sintering promoter is a compound that removes copper oxide from copper at a temperature higher than ambient temperature. The sintering promoter thereby removes surface oxide coatings from the copper particulates 11 during the photo-sintering of the copper particulates 11.