SEMICONDUCTOR PACKAGE HAVING IC DICE AND VOLTAGE TUNERS

A semiconductor package includes an interposer and a plurality of integrated circuit (IC) dice disposed on and intercoupled via the interposer. A first IC die has a clock speed rating that is greater than a clock speed rating of another of the IC dice. A plurality of programmable voltage tuners are...

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Hauptverfasser: VO, Thao, H.T, LI, Xiao-Yu, KLEIN, Matthew, H, GAN, Andy, H
Format: Patent
Sprache:eng ; fre ; ger
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Zusammenfassung:A semiconductor package includes an interposer and a plurality of integrated circuit (IC) dice disposed on and intercoupled via the interposer. A first IC die has a clock speed rating that is greater than a clock speed rating of another of the IC dice. A plurality of programmable voltage tuners are coupled to the plurality of IC dice, respectively. A first voltage tuner is coupled to the first IC die, and the first voltage tuner is programmed to reduce a voltage level of voltage input to the first voltage tuner and output the reduced voltage to the first IC die.