POLYIMIDE COVER SUBSTRATE

Disclosed is a polyimide cover substrate, which has a thickness of a predetermined level or more to implement processes, and can prevent generation of usual scratches in a flexible electronic device and can protect a substructure, and also has conductivity to thus provide a touch-integrated transpar...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	JUNG, Hak Gee, HONG, Ki ll
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	CALCULATING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS COMPUTING COUNTING ELECTRIC DIGITAL DATA PROCESSING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PERFORMING OPERATIONS PHYSICS PRINTED CIRCUITS TRANSPORTING
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Beschreibung
Zusammenfassung:	Disclosed is a polyimide cover substrate, which has a thickness of a predetermined level or more to implement processes, and can prevent generation of usual scratches in a flexible electronic device and can protect a substructure, and also has conductivity to thus provide a touch-integrated transparent polyimide cover substrate which enables screen touch.