REFLOW SOLDERABLE FLEXIBLE CIRCUIT BOARD - TO - FLEXIBLE CIRCUIT BOARD CONNECTOR REINFORCEMENT

A system embodiment may include a first flexible substrate with a first number of conductors, the first flexible substrate configured to be mechanically flexed. The system may further include a surface mounted device (SMD) mounted on the first flexible substrate and connected to at least some of the...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	Lambert, Andy, Johansson, Susie
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS DEAF-AID SETS ELECTRIC COMMUNICATION TECHNIQUE ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKEACOUSTIC ELECTROMECHANICAL TRANSDUCERS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS PUBLIC ADDRESS SYSTEMS
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Beschreibung
Zusammenfassung:	A system embodiment may include a first flexible substrate with a first number of conductors, the first flexible substrate configured to be mechanically flexed. The system may further include a surface mounted device (SMD) mounted on the first flexible substrate and connected to at least some of the first number of conductors, and a first board-to-board connector element connected to at least some of the first number of conductors on a first side of the substrate. The first board-to-board connector element is configured to mechanically connect to a second board-to-board connector element on a second flexible substrate and to electrically connect at least some of the first number of conductors in the first flexible substrate to at least some conductors in the second flexible substrate. The system may further include a stiffener board connected by solder to a second side of the first flexible substrate opposite the board-to-board connector element.