SINTERED BODY COMPRISING LICOO2 SPUTTERING TARGET, AND PRODUCTION METHOD FOR SINTERED BODY COMPRISING LICOO2

Provided is a sintered body comprising LiCoO 2 used for a sputtering target. The area A of a surface of the sintered body that corresponds to a sputtering surface is 200 - 1500 cm 2 and the relative density of the entire sintered body is 75% or higher. When B1 represents the area of a region in whic...

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Bibliographische Detailangaben
Hauptverfasser:	TAKETOMI, YUICHI, KANAMARU, MORIYOSHI
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	ARTIFICIAL STONE BASIC ELECTRIC ELEMENTS CEMENTS CERAMICS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDINGMATERIALS CONCRETE DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL LIME, MAGNESIA METALLURGY PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSIONOF CHEMICAL INTO ELECTRICAL ENERGY REFRACTORIES SLAG SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION TREATMENT OF NATURAL STONE
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Beschreibung
Zusammenfassung:	Provided is a sintered body comprising LiCoO 2 used for a sputtering target. The area A of a surface of the sintered body that corresponds to a sputtering surface is 200 - 1500 cm 2 and the relative density of the entire sintered body is 75% or higher. When B1 represents the area of a region in which the area ratio that is occupied by pores is 10% or higher in the surface that corresponds to a sputtering surface, the ratio of B1 to the area A is 50% or higher, and the area B2 of a region having a specific resistance of 1.0 × 10 2 ©-cm or smaller in the surface that corresponds to a sputtering surface occupies 25% or more of the area A.