CONTROL APPARATUS

A control apparatus (100) comprises a switch IC (130) disposed on a multi-layer printed circuit board (150) having N (N is an integer equal to or greater than 3) wiring layers (L1 - L4). The switch IC (130) is an IC package including a semiconductor switch (131) for driving a resistive load (300). [...

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Bibliographische Detailangaben
Hauptverfasser:	KUMAZAWA, SHINJI, TODA, SATORU
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS BASIC ELECTRONIC CIRCUITRY BLASTING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS COMBUSTION ENGINES CONVERSION OR DISTRIBUTION OF ELECTRIC POWER ELECTRIC SWITCHES ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY EMERGENCY PROTECTIVE CIRCUIT ARRANGEMENTS EMERGENCY PROTECTIVE DEVICES GENERATION HEATING HOT-GAS OR COMBUSTION-PRODUCT ENGINE PLANTS IGNITION, OTHER THAN COMPRESSION IGNITION, FORINTERNAL-COMBUSTION ENGINES LIGHTING MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MECHANICAL ENGINEERING PRINTED CIRCUITS PULSE TECHNIQUE RELAYS SELECTORS TESTING OF IGNITION TIMING IN COMPRESSION-IGNITION ENGINES WEAPONS
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Beschreibung
Zusammenfassung:	A control apparatus (100) comprises a switch IC (130) disposed on a multi-layer printed circuit board (150) having N (N is an integer equal to or greater than 3) wiring layers (L1 - L4). The switch IC (130) is an IC package including a semiconductor switch (131) for driving a resistive load (300). [Problem] When the insulating layers of a printed circuit board are overheated and carbonized by the heat generated from a broken semiconductor switch and a short circuit is formed between conductor traces, a large leak current flows therethrough. [Means for Solution] When M (M is an integer which is not less than 2 but not greater than N) wiring layers (counted from the front surface on which a switch IC is mounted) of the N (N is an integer equal to or greater than 3) wiring layers of a printed circuit board and the switch IC are projected in the thickness direction of the printed circuit board, in a region which overlaps with the die of the semiconductor switch of the switch IC, (i) a current path trace on the high voltage side of the semiconductor switch is present, and (ii) a signal ground connection wiring trace and a current path trace on the low voltage side of the semiconductor switch are not present.