CURABLE PRESSURE-SENSITIVE ADHESIVE COMPOSITIONS

The present disclosure is directed to a curable precursor of a pressure sensitive adhesive composition comprising: (1) a free-radically polymerizable material comprising at least one free-radically polymerizable monomer; (2) a polymerization initiator system, comprising: a) a thermal redox initiator...

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Bibliographische Detailangaben
Hauptverfasser:	GOEB, SIEGFRIED RAINER, RICHTER, MAREIKE, SCHUELL, CHRISTOPH, UNVERHAU, KERSTIN
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY COMPOSITIONS BASED THEREON DYES MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	The present disclosure is directed to a curable precursor of a pressure sensitive adhesive composition comprising: (1) a free-radically polymerizable material comprising at least one free-radically polymerizable monomer; (2) a polymerization initiator system, comprising: a) a thermal redox initiator system, consisting of: i. a thermal polymerization initiator comprising an organic peroxide; and ii. an accelerator selected from the group consisting of tertiary amines, metal salts, mercaptans, and any combinations or mixtures thereof; and b) a photoinitiator. The present disclosure is also directed to a method of manufacturing such pressure sensitive adhesives and uses thereof.