LIGHT-TRANSMITTING IMPRINTING MOLD AND METHOD FOR MANUFACTURING LARGE-AREA MOLD

An imprint method including the steps of: an exposing step to irradiate a photo curing resin, coated on a large-area substrate, with a curing light while the light-transmitting imprint mold is pressed against the photo curing resin, an amount of the curing light applied onto the photo curing resin i...

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Bibliographische Detailangaben
1. Verfasser:	MIYAZAWA, Yukihiro
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING APPARATUS SPECIALLY ADAPTED THEREFOR BASIC ELECTRIC ELEMENTS CINEMATOGRAPHY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR ORIGINALS THEREFOR PERFORMING OPERATIONS PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS SEMICONDUCTOR DEVICES SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	An imprint method including the steps of: an exposing step to irradiate a photo curing resin, coated on a large-area substrate, with a curing light while the light-transmitting imprint mold is pressed against the photo curing resin, an amount of the curing light applied onto the photo curing resin in a light shielding region provided with the light shielding member (5) made less than an amount of the curing light applied onto the photo curing resin in a light transmitting region of the mold so that a portion of the photo curing resin in the light shielding region is semi-cured by the use of the light shielding member (5) provided so as to reproduce the concave-convex pattern of the transparent substrate; a separating step to separate the mold from the photo curing resin after the exposing step; a moving step to move the mold so that an end of the light transmitting region of the mold is positioned on the semi-cured portion (9b) of the photo curing resin; and a repeating step to repeat the exposing step and the separating step with the mold positioned at a position after the moving step.