3D MEMORY

Three-dimensional memory cells and methods of making and using the memory cells are discussed generally herein. In one or more embodiments, a three-dimensional vertical memory can include a memory stack. Such a memory stack can include memory cells and a dielectric between adjacent memory cells, eac...

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Bibliographische Detailangaben
Hauptverfasser: JAYANTI, SRIKANT, MAURI, AURELIO GIANCARLO, FAN, DARWIN FRANSEDA, BRIGHTEN, JAMES, HOPKINS, JOHN, SIMSEK-EGE, FATMA ARZUM
Format: Patent
Sprache:eng ; fre ; ger
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Zusammenfassung:Three-dimensional memory cells and methods of making and using the memory cells are discussed generally herein. In one or more embodiments, a three-dimensional vertical memory can include a memory stack. Such a memory stack can include memory cells and a dielectric between adjacent memory cells, each memory cell including a control gate and a charge storage structure. The memory cell can further include a barrier material between the charge storage structure and the control gate, the charge storage structure and the barrier material having a substantially equal dimension.