SEMICONDUCTOR DEVICE

In order to provide a semiconductor device having high ESD tolerance, a semiconductor device (IC) is formed so that: a ground voltage wiring (22a) is electrically connected at one end in a wiring direction thereof to a wiring (22b) extending from a ground voltage pad used for external connection; an...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	SHIMAZAKI, KOICHI, HIROSE, YOSHITSUGU
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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