MICROMACHINED ULTRASONIC TRANSDUCER DEVICES WITH METAL-SEMICONDUCTOR CONTACT FOR REDUCED CAPACITIVE CROSS-TALK

MICROMACHINED ULTRASONIC TRANSDUCER DEVICES WITH METAL-SEMICONDUCTOR CONTACT FOR REDUCED CAPACITIVE CROSS-TALK

Embodiments reduce capacitive cross-talk between micromachined ultrasonic transducer (MUT) arrays through grounding of the substrate over which the arrays are fabricated. In embodiments, a metal-semiconductor contact is formed to a semiconductor device layer of a substrate and coupled to a ground pl...

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Bibliographische Detailangaben
Hauptverfasser: GARDNER, Deane, LATEV, Dimitre, LAW, Hung-Fai Stephen, HAJATI, Arman
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
CHAMBERS PROVIDED WITH MANIPULATION DEVICES
ELECTRICITY
FOR PERFORMING MECHANICAL WORK IN GENERAL
GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
HAND TOOLS
MANIPULATORS
METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICALVIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY
PERFORMING OPERATIONS
PORTABLE POWER-DRIVEN TOOLS
TRANSPORTING
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Beschreibung
Zusammenfassung:Embodiments reduce capacitive cross-talk between micromachined ultrasonic transducer (MUT) arrays through grounding of the substrate over which the arrays are fabricated. In embodiments, a metal-semiconductor contact is formed to a semiconductor device layer of a substrate and coupled to a ground plane common to a first electrode of the transducer elements to suppress capacitive coupling of signal lines connected to a second electrode of the transducer elements.