Semiconductor package

A semiconductor package comprises an integrated device, a front side (1) of a material A and a back side (2) of a material B opposite to the front side (1). Side walls (3) link the front side (1) and the back side (2). Each side wall (3) is coated with a coating material (4) to at least 80 % of its...

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Bibliographische Detailangaben
1. Verfasser:	WERNER, HUNZIKER
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MICROSTRUCTURAL TECHNOLOGY PERFORMING OPERATIONS PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS SEMICONDUCTOR DEVICES TRANSPORTING
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Beschreibung
Zusammenfassung:	A semiconductor package comprises an integrated device, a front side (1) of a material A and a back side (2) of a material B opposite to the front side (1). Side walls (3) link the front side (1) and the back side (2). Each side wall (3) is coated with a coating material (4) to at least 80 % of its area, wherein the coating material (4) is different from the material A and different from the material B.