Method of inhibiting copper deposition on hair
Use of a shampoo composition comprising from 0.025% to 0.25% histidine, by weight of the shampoo composition, from 2% to 50% of one or more detersive surfactants, by weight of the shampoo composition, and from 20% to 95% of an aqueous carrier, by weight of the shampoo composition for inhibiting copp...
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| Format: | Patent |
| Sprache: | eng ; fre ; ger |
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| Zusammenfassung: | Use of a shampoo composition comprising from 0.025% to 0.25% histidine, by weight of the shampoo composition, from 2% to 50% of one or more detersive surfactants, by weight of the shampoo composition, and from 20% to 95% of an aqueous carrier, by weight of the shampoo composition for inhibiting copper deposition on hair and facilitating the removal of copper deposited on hair. |
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