CHIP PACKAGE ASSEMBLY AND METHOD TO USE THE ASSEMBLY

CHIP PACKAGE ASSEMBLY AND METHOD TO USE THE ASSEMBLY

A chip package assembly and its use for mounting and demounting of at least one semiconductor chip that includes a flange and a substrate, where the at least one chip and the substrate are arranged on one side of the flange, and where the flange is composed of an electrical and thermally conducting...

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Bibliographische Detailangaben
Hauptverfasser: IVANOV, EVGENY VALERYEVICH, KRASNOV, ANDREY ALEKSANDROVICH, TIKHOMIROVA, NADEZHDA VLADIMIROVNA, SHARKOV, GEORGY BORISOVICH
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A chip package assembly and its use for mounting and demounting of at least one semiconductor chip that includes a flange and a substrate, where the at least one chip and the substrate are arranged on one side of the flange, and where the flange is composed of an electrical and thermally conducting material.