Thin NiB or CoB capping layer for non-noble metal bond pads

Thin NiB or CoB capping layer for non-noble metal bond pads

The invention relates to a substrate having at least one main surface comprising at least one non-noble metallic bonding landing pad (2) covered by a capping layer (3) thereby shielding the non-noble metallic bonding landing pad (2) from the environment. This capping layer comprises an alloy, the al...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: BEYNE, ERIC, ENGLAND, LUKE, VAKANAS, GEORGE, DE VOS, JOERI, DERAKHSHANDEH, JABER
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:The invention relates to a substrate having at least one main surface comprising at least one non-noble metallic bonding landing pad (2) covered by a capping layer (3) thereby shielding the non-noble metallic bonding landing pad (2) from the environment. This capping layer comprises an alloy, the alloy being NiB or CoB and containing an atomic concentration percentage of boron in the range of 10% to 50%.