THERMOSETTING RESIN COMPOSITION

The present invention is contemplated for providing a thermosetting resin composition having all of heat resistance, UV resistance and a high refractive index, and the thermosetting resin composition having high adhesion and improved moisture-absorption reflow resistance, heat cycle resistance and s...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	AYAMA KOICHI, MATSUO TAKASHI, KAWABATA KIICHI, TAJIMA AKIO, UENO YOSHIKO
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	The present invention is contemplated for providing a thermosetting resin composition having all of heat resistance, UV resistance and a high refractive index, and the thermosetting resin composition having high adhesion and improved moisture-absorption reflow resistance, heat cycle resistance and sulfur resistance and being excellent in reliability as an LED sealing agent. The invention relates to the thermosetting resin composition containing (A) to (D): (A) a thermosetting resin containing an SiH group and an alkenyl group, being a reaction product between silsesquioxane having an SiH group and an organopolysiloxane having two alkenyl groups; (B) a thermosetting resin having an SiH group as obtained by allowing reaction among silsesquioxane having an SiH group, organopolysiloxane having two alkenyl groups, an epoxy compound having an alkenyl group and a silyl compound having an alkenyl group; (C) a linear organopolysiloxane compound having an SiH group only at one terminal; and (D) a Pt catalyst.