THERMOSETTING RESIN COMPOSITION

The invention relates to a thermosetting resin composition containing (A) to (D) below. (A) A thermosetting resin containing an SiH group and an alkenyl group, wherein the thermosetting resin is a reaction product between silsesquioxane having the SiH group and organopolysiloxane having two alkenyl...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	AYAMA KOICHI, MATSUO TAKASHI, KAWABATA KIICHI, TAJIMA AKIO
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	The invention relates to a thermosetting resin composition containing (A) to (D) below. (A) A thermosetting resin containing an SiH group and an alkenyl group, wherein the thermosetting resin is a reaction product between silsesquioxane having the SiH group and organopolysiloxane having two alkenyl groups; (B) a linear organopolysiloxane compound having an SiH group only at one terminal; (C) a silane coupling agent having an epoxy group; and (D) a Pt catalyst.