Method and apparatus for testing ic devices including temperature verification
The invention provides a method of feeding integrated circuit devices to a test site of a handling system for handling integrated circuit devices, comprising the steps of: temperature conditioning integrated circuit devices in a buffer region of the handling system for a predetermined first time int...
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| Format: | Patent |
| Sprache: | eng ; fre ; ger |
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| Zusammenfassung: | The invention provides a method of feeding integrated circuit devices to a test site of a handling system for handling integrated circuit devices, comprising the steps of: temperature conditioning integrated circuit devices in a buffer region of the handling system for a predetermined first time interval; measuring the temperature of an integrated circuit device in the buffer region after the predetermined first time interval has elapsed; and releasing the integrated circuit device for testing, if the measured temperature is within a predetermined temperature range. The invention further provides a handling system comprising: means for temperature conditioning integrated circuit devices in a buffer region of the handling system for a predetermined first time interval; means for measuring the temperature of an integrated circuit device in the buffer region after the predetermined first time interval has elapsed; and means for releasing the integrated circuit device for testing, if the measured temperature is within a predetermined temperature range. |
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