Solderless hearing assistance device assembly and method

Disclosed herein, among other things, are systems and methods for solderless assembly for hearing assistance devices. One aspect ofthe present subject matter includes a method of manufacturing a hearing assistance device. According to various embodiments, the method includes providing a molded inter...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	Prchal, David, Krzmarzick, Susie, Dzarnoski, John, Link, Douglas F
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS CURRENT COLLECTORS DEAF-AID SETS ELECTRIC COMMUNICATION TECHNIQUE ELECTRICITY LINE CONNECTORS LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKEACOUSTIC ELECTROMECHANICAL TRANSDUCERS PUBLIC ADDRESS SYSTEMS
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	Disclosed herein, among other things, are systems and methods for solderless assembly for hearing assistance devices. One aspect ofthe present subject matter includes a method of manufacturing a hearing assistance device. According to various embodiments, the method includes providing a molded interconnect device (MID) housing and inserting a flexible circuit module having conductive surface traces into the MID housing. One or more hearing assistance electronic modules are connected to the MID housing using direct compression without the use of wires or solder, according to various embodiments. In one embodiment, the MID housing includes a laser-direct structuring (LDS) housing.