Solderless hearing assistance device assembly and method

Solderless hearing assistance device assembly and method

Disclosed herein, among other things, are systems and methods for solderless assembly for hearing assistance devices. One aspect ofthe present subject matter includes a method of manufacturing a hearing assistance device. According to various embodiments, the method includes providing a molded inter...

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Hauptverfasser: PRCHAL, DAVID, DZARNOSKI, JOHN, LINK, DOUGLAS F, KRZMARZICK, SUSIE
Format: Patent
Sprache:eng ; fre ; ger
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DEAF-AID SETS
ELECTRIC COMMUNICATION TECHNIQUE
ELECTRICITY
LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKEACOUSTIC ELECTROMECHANICAL TRANSDUCERS
PUBLIC ADDRESS SYSTEMS
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creator PRCHAL, DAVID
DZARNOSKI, JOHN
LINK, DOUGLAS F
KRZMARZICK, SUSIE
description Disclosed herein, among other things, are systems and methods for solderless assembly for hearing assistance devices. One aspect ofthe present subject matter includes a method of manufacturing a hearing assistance device. According to various embodiments, the method includes providing a molded interconnect device (MID) housing and inserting a flexible circuit module having conductive surface traces into the MID housing. One or more hearing assistance electronic modules are connected to the MID housing using direct compression without the use of wires or solder, according to various embodiments. In one embodiment, the MID housing includes a laser-direct structuring (LDS) housing.
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subjects DEAF-AID SETS
ELECTRIC COMMUNICATION TECHNIQUE
ELECTRICITY
LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKEACOUSTIC ELECTROMECHANICAL TRANSDUCERS
PUBLIC ADDRESS SYSTEMS
title Solderless hearing assistance device assembly and method
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