Solderless hearing assistance device assembly and method

Disclosed herein, among other things, are systems and methods for solderless assembly for hearing assistance devices. One aspect ofthe present subject matter includes a method of manufacturing a hearing assistance device. According to various embodiments, the method includes providing a molded inter...

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Bibliographische Detailangaben
Hauptverfasser:	PRCHAL, DAVID, DZARNOSKI, JOHN, LINK, DOUGLAS F, KRZMARZICK, SUSIE
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	DEAF-AID SETS ELECTRIC COMMUNICATION TECHNIQUE ELECTRICITY LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKEACOUSTIC ELECTROMECHANICAL TRANSDUCERS PUBLIC ADDRESS SYSTEMS
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Beschreibung
Zusammenfassung:	Disclosed herein, among other things, are systems and methods for solderless assembly for hearing assistance devices. One aspect ofthe present subject matter includes a method of manufacturing a hearing assistance device. According to various embodiments, the method includes providing a molded interconnect device (MID) housing and inserting a flexible circuit module having conductive surface traces into the MID housing. One or more hearing assistance electronic modules are connected to the MID housing using direct compression without the use of wires or solder, according to various embodiments. In one embodiment, the MID housing includes a laser-direct structuring (LDS) housing.