Pressuring module, pressuring apparatus, and substrate bonding apparatus
The present invention relates to a pressuring apparatus comprising: a first surface; a second surface that opposes the first surface such that a plurality of semiconductor substrates is between the first surface and the second surface; a driving unit operable to move the first surface toward the sec...
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| Hauptverfasser: | , |
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| Format: | Patent |
| Sprache: | eng ; fre ; ger |
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| Zusammenfassung: | The present invention relates to a pressuring apparatus comprising: a first surface; a second surface that opposes the first surface such that a plurality of semiconductor substrates is between the first surface and the second surface; a driving unit operable to move the first surface toward the second surface until the first surface reaches a predetermined position; and a pressing unit operable to deliver a pressing force to the first surface towards the second surface. |
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