SEMICONDUCTOR DEVICE

In order to inhibit a crack under a pad opening without increasing a chip size, a protective film (6) includes a pad opening (9) that exposes a part of a topmost layer metal film (3). The pad opening (9) is rectangular and square, and has an opening width of d0. A second metal film (2) has an openin...

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Bibliographische Detailangaben
Hauptverfasser:	SAKURAI, Hitomi, RISAKI, Tomomitsu, NAKANISHI, Shoji, SHIMAZAKI, Koichi
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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Beschreibung
Zusammenfassung:	In order to inhibit a crack under a pad opening without increasing a chip size, a protective film (6) includes a pad opening (9) that exposes a part of a topmost layer metal film (3). The pad opening (9) is rectangular and square, and has an opening width of d0. A second metal film (2) has an opening under the pad opening (9). The opening is rectangular and square, and has an opening width of d4. A distance between an opening edge of the protective film (6) and an opening edge of the second metal film (2) is d3. The second metal film (2) has a rectangular donut shape, and protrudes to an inner side of the pad opening (9) by the distance d3.