Semiconductor device with optical and electrical vias
The semiconductor device comprises a semiconductor substrate (1) and an optical via (4) penetrating the substrate from a main surface (12) to an opposite further main surface (13). A metal via layer (5) is arranged along the optical via without closing the optical via. A contact pad (19) is arranged...
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| creator | Teva, Jordi Rohracher, Karl Kraft, Jochen |
| description | The semiconductor device comprises a semiconductor substrate (1) and an optical via (4) penetrating the substrate from a main surface (12) to an opposite further main surface (13). A metal via layer (5) is arranged along the optical via without closing the optical via. A contact pad (19) is arranged above the further main surface at a distance from the optical via. A through-substrate via (14) comprising a further metal via layer (15) is arranged in the substrate, the through-substrate via penetrating the substrate from the main surface to the contact pad. The further metal via layer is in electrical contact with the contact pad. |
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A metal via layer (5) is arranged along the optical via without closing the optical via. A contact pad (19) is arranged above the further main surface at a distance from the optical via. A through-substrate via (14) comprising a further metal via layer (15) is arranged in the substrate, the through-substrate via penetrating the substrate from the main surface to the contact pad. 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| language | eng ; fre ; ger |
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| subjects | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS OPTICS PHYSICS PRINTED CIRCUITS SEMICONDUCTOR DEVICES |
| title | Semiconductor device with optical and electrical vias |
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