Semiconductor device with optical and electrical vias

The semiconductor device comprises a semiconductor substrate (1) and an optical via (4) penetrating the substrate from a main surface (12) to an opposite further main surface (13). A metal via layer (5) is arranged along the optical via without closing the optical via. A contact pad (19) is arranged above the further main surface at a distance from the optical via. A through-substrate via (14) comprising a further metal via layer (15) is arranged in the substrate, the through-substrate via penetrating the substrate from the main surface to the contact pad. The further metal via layer is in electrical contact with the contact pad.