Heat exchange devices, liquid adhesive systems, and related methods

A heat exchange device (10, 110) for heating liquid adhesive material to an application temperature suitable for an adhesive bonding application includes a body (12, 112) having an inlet (14, 140) configured to receive a flow of liquid adhesive material and an outlet (16, 134) configured to provide...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	LANIER, JAY, CLARK, STEVEN, SAIDMAN, LAURENCE B, FORT, WESLEY C, GOULD, MARK A
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL ATOMISING APPARATUS NOZZLES PERFORMING OPERATIONS SPRAYING APPARATUS SPRAYING OR ATOMISING IN GENERAL TRANSPORTING
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