Heat exchange devices, liquid adhesive systems, and related methods

A heat exchange device (10, 110) for heating liquid adhesive material to an application temperature suitable for an adhesive bonding application includes a body (12, 112) having an inlet (14, 140) configured to receive a flow of liquid adhesive material and an outlet (16, 134) configured to provide the liquid adhesive material to a dispensing device (20, 114) for the adhesive bonding application. A fluid passageway (22, 140) in the body (12, 112) connects the inlet (14, 140) and the outlet (16, 134). The fluid passageway (22, 140) includes a thin slit section (28, 146) having a length along a fluid flow direction between the inlet (14, 140) and the outlet (16, 134), the thin slit section (28, 146) further having a first dimension and a second dimension transverse to the fluid flow direction. The first dimension and the length are substantially greater than the second dimension. The heat exchange (10, 110) further includes a heating element (56, 170) for heating the liquid adhesive material flowing through the thin slit section (28, 146) to the application temperature.