SEMICONDUCTOR MODULE AND SEMICONDUCTOR DEVICE

To obtain a semiconductor module that can fix itself onto a fixing object while enabling further miniaturization and alleviating the load applied to a molded resin, a semiconductor module 7 includes a semiconductor element 1; a placing frame 2 on which the semiconductor element 1 is placed; a contro...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	KAWAUCHI, YUKI, KITAI, KIYOFUMI
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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