SEMICONDUCTOR MODULE AND SEMICONDUCTOR DEVICE

To obtain a semiconductor module that can fix itself onto a fixing object while enabling further miniaturization and alleviating the load applied to a molded resin, a semiconductor module 7 includes a semiconductor element 1; a placing frame 2 on which the semiconductor element 1 is placed; a contro...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: KAWAUCHI, YUKI, KITAI, KIYOFUMI
Format: Patent
Sprache:eng ; fre ; ger
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Beschreibung
Zusammenfassung:To obtain a semiconductor module that can fix itself onto a fixing object while enabling further miniaturization and alleviating the load applied to a molded resin, a semiconductor module 7 includes a semiconductor element 1; a placing frame 2 on which the semiconductor element 1 is placed; a control substrate 5 onto which a control component 14 for controlling the semiconductor element 1 is mounted; and a molded resin 8 in which the semiconductor element 1, the placing frame 2, and the control substrate 5 are integrally molded. Fixing bases 5a exposed from the molded resin 8 are provided on the control substrate 5 for fixing the semiconductor module 7 onto a fixing object.