SEMICONDUCTOR DEVICE

To obtain a semiconductor module that can fix itself onto a fixing object while enabling further miniaturization and alleviating the load applied to a molded resin, a semiconductor module 7 includes a semiconductor element 1; a placing frame 2 on which the semiconductor element 1 is placed; a contro...

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Bibliographische Detailangaben
Hauptverfasser:	KAWAUCHI, YUKI, KITAI, KIYOFUMI
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	To obtain a semiconductor module that can fix itself onto a fixing object while enabling further miniaturization and alleviating the load applied to a molded resin, a semiconductor module 7 includes a semiconductor element 1; a placing frame 2 on which the semiconductor element 1 is placed; a control substrate 5 onto which a control component 14 for controlling the semiconductor element 1 is mounted; and a molded resin 8 in which the semiconductor element 1, the placing frame 2, and the control substrate 5 are integrally molded. Fixing bases 5a exposed from the molded resin 8 are provided on the control substrate 5 for fixing the semiconductor module 7 onto a fixing object.