EPOXY/VINYL COPOLYMER-TYPE LIQUID RESIN COMPOSITION, CURED ARTICLE THEREOF, ELECTRICAL/ELECTRONIC DEVICE USING SAID CURED ARTICLE, AND METHOD FOR PRODUCING SAID CURED ARTICLE

The present invention provides an epoxy-vinyl copolymerization type liquid resin composition and a cured product of the same. The resin composition contains: an epoxy resin having an epoxy resin equivalent of not more than 200 g/eq; an acid anhydride having an unsaturated double bond that is liquid...

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1. Verfasser: AMOU, SATORU
Format: Patent
Sprache:eng ; fre ; ger
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Zusammenfassung:The present invention provides an epoxy-vinyl copolymerization type liquid resin composition and a cured product of the same. The resin composition contains: an epoxy resin having an epoxy resin equivalent of not more than 200 g/eq; an acid anhydride having an unsaturated double bond that is liquid at normal temperature or the acid anhydride having an unsaturated double bond that is liquid at normal temperature and maleic anhydride; a polyfunctional monomer which is liquid at normal temperature; an epoxy resin curing catalyst which accelerates a curing reaction of the epoxy resin with the acid anhydride or with the acid anhydride and maleic anhydride; and a radical polymerization catalyst which accelerates a curing reaction of the polyfunctional monomer. This makes it possible to reduce varnish viscosity and to enhance heat resistance of the cured product. Further, it is also possible to provide a cured product formed by curing the thermosetting resin composition, and to provide an electronic/electric apparatus in which the cured product is used as an insulating material or/and a structural material.